Xiaomi is set to launch the XRING 01, its first in-house smartphone chipset, later this month. According to Xiaomi CEO Lei Jun, this new processor will debut in a new handset. While it is anticipated to be a high-performance chip, it is unlikely to surpass the capabilities of flagship processors like the Snapdragon 8 Elite or the MediaTek Dimensity 9400. Introducing Xiaomi’s processor could help the company reduce its reliance on chipmakers such as Qualcomm and MediaTek, and may also support its electric vehicle (EV) business.
Mi XRING 01 Launch Timeline
According to a post by Xiaomi’s CEO on Chinese microblogging website Weibo, the Mi XRING 01 will be released “at the end of May.” The executive said the company independently designed and developed Xiaomi’s chipset. The post did not include any other details about the smartphone’s processor.
Meanwhile, Weibo user Digital Chat Station (translated from Chinese) claims that Mi’s XRING 01 chip will be made “within 5nm.” The tipster also says that Xiaomi’s efforts in chipmaking over the past decade will eventually allow it to join other handset makers that make their own processors — Apple, Google, Huawei, and Samsung.
Last month, another tipster leaked details of Xiaomi’s in-house chipset, claiming it will have a 1+3+4 CPU layout. The chip is said to feature one Cortex-X925 core (3.2GHz), three Cortex-A725 cores (2.6GHz), and four Cortex-A520 cores (2.0GHz). It is also expected to feature an IMG DXT-72 GPU from Imagination Technologies.
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The leaker also claimed that the chip will be manufactured using TSMC’s N4P process technology, which is cheaper for Xiaomi than TSMC’s latest N3E node, which is currently used to make flagship mobile chips.
The company has not announced which phones will be the first to feature the new Xiaomi XRING 01 chip. However, based on Xiaomi’s revealed launch timeline, we can expect more details about the process to emerge in the coming days.
